We offer several brands of burn-in sockets from established suppliers throughout the test industry.
Each supplier offers an extensive catalog of finished sockets that are ready to fulfill burn-in, humidity, failure analysis, and engineering test requirements for the latest packaged devices, including QFN, LGA, SOIC, TSSOP, BGA and μBGA styles.
We also have several lines of memory module sockets, and related items for PC industry use.